Combine signal processing circuitry, software and the functionality of microphones or speakers onto a single, standard CMOS semiconductor chip

Deliver a range of advanced acoustic solutions such as directionality, noise cancellation and digital integration

Can be rapidly and cost-effectively designed and configured to meet the specific requirements of different device and system architectures

Enable component reduction and subsystem integration and can be assembled using automated Surface Mount Technology processes

Fabricated using standard and widely available CMOS processes and foundries, ensuring they are produced with the best available technologies, consistent quality and scalable capacity