Packaging Engineer
Akustica Inc., a MEMS technology company located in the Southside Works of Pittsburgh, seeks a Packaging Engineer to design and implement MEMS packages that have a high degree of manufacturability within a large volume process. Position will also assist in sustaining the engineering function for current packaging technology.
Responsibilities Include:
- Participate in programs on cost reduction, quality and yield improvement tasks
- Design packages by using package layout software and simulation tools
- Adapt packaging processes according to special MEMS requirements
- Work with IC and MEMS design engineering teams to accommodate special acoustic and mechanical requirements
Qualifications:
- B.S. in Materials Science or Mechanical Engineering
- Experience in package design and development; MEMS packaging experience a plus
- Basic understanding of relationship between materials and package performance (experience in MEMS packaging a plus
- Experience in the design and manufacturing of multi-layer organic substrate/circuit boards (familiarity/operational ability on industry standard design platforms [SolidWorks,Altium])
- Familiarity with current high volume IC/MEMS assembly processes (die attach, flip chip, wafer saw, wire bond, direct chip attach, surface mount, package singulation etc)
- Experience in failure analysis methodology
Compensation:
Akustica offers a comprehensive benefits package including health, dental and vision insurance, 401k with match, and paid vacation, holidays and sick time.
To apply for this position, please send us an email with a cover letter, salary requirements, references, and resume to [email protected]