Akustica Management Team


Horst Muenzel
CEO & General Manager
Acting Vice President of Sales & Marketing

 

 

Mr. Horst Muenzel brings over 30 years of experience in engineering and manufacturing, of high volume, high quality sensors. Most recently, the Regional President for the Robert Bosch Research and Technology Center in Palo Alto, CA, Mr. Muenzel previously held other senior positions at Bosch including Vice President of MEMS Engineering in the Automotive Electronics Division and head of manufacturing for automotive power diodes. He started his career at Bosch in 1989 as the Director of MEMS Engineering where he was a core member of the startup team for MEMS sensors. This team developed the first generation of MEMS sensors at Bosch and transferred these concepts into large scale series production technologies.

Mr. Muenzel earned a Ph.D. in Electrical Engineering from the Technische Universität Darmstadt.


 


Stefan Linde
Vice President Operations



Mr. Linde is responsible for planning, controlling, logistics, product engineering and purchasing.  Mr. Linde brings a broad knowledge of finance and supply chain management to the Akustica team, with over 14 years of experience. Prior to joining Akustica, he held various roles within Bosch, including leadership positions within the Automotive Electronics Division.

Mr. Linde holds a masters degree in business and engineering. 

 

 

 


 


Susan Earley
Vice President Finance & Administration


Ms. Earley brings to Akustica over 20 years of extensive technology experience. She has served for 15 years as the Chief Financial Officer of Optimum Power Technology and its affiliate, Emprise Technologies. Ms. Earley’s prior employment has included LEGENT Corporation where she was the controller. She also worked at Coopers & Lybrand for 5 years. Her hands-on experience brings Akustica a valuable leader and executive team member.

 

Ms. Earley graduated from Grove City College with a Bachelor of Arts in Accounting.


Tina Lamers
Vice President Engineering

 

Ms Lamers is a seasoned R&D professional with more than 15 years of MEMS engineering experience and 5 years of semiconductor experience. Ms Lamers has held various leadership positions in development, marketing and manufacturing at Avago Technologies, Agilent Technologies and Hewlett Packard. In her previous role, Ms Lamers was R&D Manager of Avago’s FBAR filter technology development, a product line that grew more than 10x during her tenure. Ms Lamers brings strong technical expertise and cross-functional team leadership skills to the Akustica executive team.

Ms Lamers holds a Master of Science in Manufacturing Systems Engineering and a PhD in Mechanical Engineering with a minor in Electrical Engineering from Stanford University.


Ketan Patel
Vice President Quality & Reliability

 

 

Mr. Patel has a wide variety of international experience and education in different sensors field is very valuable in defining and providing reliability test solutions for very high quality MEMS microphones.  Prior to joining Akustica, Mr. Patel worked as Project Manager on MEMS DRIE systems, plasma sensors, hydrogen sensors, and IR sensors at Alcatel Vacuum Technology, France.

Mr. Patel received his MBA from University of Pittsburgh. In addition, he received Master’s in Radio Frequency Engineering from University of Strathclyde, Scotland and Master’s in Applied Physics from Maharaja Sayajirao University, India

 


Noureddine Hawat
Vice President Packaging & Test

 

 

Mr. Hawat joined Akustica in 2015, bringing over 26 years of experience in the areas of semiconductor and MEMS industries with proven expertise in new product development, integrated products, production transition, production support, and test. During his career, Mr. Hawat has worked in various assignments from startup to large cap companies including Memsic, Custom One Design, Thermo Electron and M/A-COM. Mr. Hawat has served in key engineering leadership positions where he led the development of 3D Magnetic Sensor Devices, Wafer Level Package products, Small GPS module, MEMS / IC’s packaging and Test.

Mr. Hawat received his Master degree in Electrical & Computer Engineering from Northeastern University